A Linux Foundation Project
OCP Platform Server Board
Project 04 · OCP Reference Platform

OCP Reference Platform
Project Charter

A complete, multi-vendor server platform reference design for POWER-class compute built on OCP DC-MHS and DC-SCM standards — integrating the OpenCore processor, OpenFSP service processor, and OpenHMC management console into a fully open, auditable, and domestically manufacturable hardware stack.

StatusForming — seeking Founding Members
PhasePre-charter / Requirements
StandardsOCP DC-MHS · DC-SCM v2.0 · Open Rack v3
LicenseApache 2.0 (SW) · OCP OSHWA (HW)
OCP MHS Motherboard · Pegatron

OCP MHS Reference Platform — ODM Design & Manufacturing Partners

Executive Summary

Software sovereignty is necessary but not sufficient. An organization that audits its hypervisor and management console firmware but runs them on a server designed, manufactured, and serviced by a single vendor has not escaped infrastructure lock-in — it has merely moved the dependency one layer down.

The OCP Reference Platform project delivers the hardware layer of the Enterprise Sovereignty Initiative: a complete server platform reference design built on Open Compute Project standards, integrating the OpenCore processor (Project 01), OpenFSP service processor (Project 03), and OpenHMC management console (Project 02) into a platform that any qualified manufacturer can produce — in any geography, from multiple supply chains, with no proprietary design elements.

The platform targets the OCP DC-MHS (Data Center Modular Hardware System) standard for the compute module, DC-SCM v2.0 for the management controller, and Open Rack v3 for the rack power and infrastructure layer. These are existing, published OCP standards adopted by hyperscalers and increasingly by regulated industries as the basis for competitive, multi-vendor hardware procurement.

Why OCP Standards

The Open Compute Project has become the dominant framework for competitive data center hardware procurement. Its standards separate the hardware specification from any single manufacturer, enabling organizations to issue competitive RFPs against published specifications rather than proprietary form factors. For regulated industries, OCP compliance means:

  • Multi-vendor sourcing: Any OCP-compliant manufacturer can produce the platform. No sole-source dependency.
  • Geographic manufacturing diversity: Published open hardware specifications can be manufactured at domestic facilities in any country with OCP-compatible manufacturing capacity.
  • Design auditability: OCP hardware designs are published. The reference platform extends this with full open source hardware design files under OCP's Open Hardware Specifications license.
  • Ecosystem compatibility: OCP-standard power, cooling, and rack infrastructure is widely deployed. The reference platform drops into existing OCP-capable data centers.

Platform Architecture: The OCP Stack

Open Rack v3
12V rack power distribution, standard shelf units, power bus bar, rack management interface. Industry-standard deployment environment compatible with existing OCP-capable data centers.
DC-MHS Chassis
OCP Data Center Modular Hardware System chassis — modular sled infrastructure supporting hot-swap compute modules, shared power and cooling infrastructure, and standardized module interconnects.
Compute Module
DC-MHS compute sled hosting the OpenCore POWER ISA processor, DDR5 memory subsystem, PCIe expansion, and local NVMe storage. Reference design published as open hardware with full schematics and BOM.
DC-SCM v2.0
OCP Data Center Secure Control Module slot hosting OpenFSP — the open source service processor. Hot-swappable, independently auditable, and separately sourceable from multiple vendors.
Fabric / Interconnect
PCIe Gen5 / CXL 3.0 inter-module fabric for memory expansion and accelerator integration. Standard OCP NIC 3.0 form factor for network interface cards.
Firmware Layer
skiboot/OPAL open firmware. OpenFSP (DC-SCM). Petitboot bootloader. All components open source, auditable, and independently updatable.

Integration with ESI Software Projects

Project 01 Integration

OpenCore Processor

The compute module reference design is built around the OpenCore POWER ISA processor as its primary silicon target. The module design also accommodates IBM commercial POWER10/11 processors to support organizations transitioning from existing IBM hardware.

Project 03 Integration

OpenFSP

The DC-SCM slot on the compute module is the reference deployment target for OpenFSP. The platform hardware design is co-developed with the OpenFSP project to ensure the DC-SCM electrical and physical interface meets OpenFSP requirements.

Project 02 Integration

OpenHMC

OpenHMC manages compute modules through the OpenFSP Redfish API. The reference platform includes a validated, certified integration configuration — enabling Founding Members to deploy OpenHMC against the reference hardware with documented support.

OCP Ecosystem

Accelerator Compatibility

OCP NIC 3.0 and PCIe card slots for AI accelerators, storage controllers, and SmartNICs. The platform targets compatibility with OCP-accepted accelerator designs to enable open AI inference deployments managed by OpenHMC.

Sovereign Manufacturing Target

The National Infrastructure Argument

For government agencies and critical infrastructure operators subject to national security procurement requirements, the OCP Reference Platform is designed to be manufactured domestically. Published hardware design files, standard OCP interfaces, and a manufacturing-ready BOM mean the platform can be sourced from any nation with semiconductor packaging and PCB manufacturing capacity — without requiring proprietary tooling, vendor partnerships, or technology transfer agreements from a single US commercial vendor.

Deliverables

Platform Requirements Specification

Published requirements document covering compute, memory, I/O, power, thermal, and management interface. Input from Founding Members. Month 4.

DC-MHS Compute Module Schematic

Full schematic for POWER ISA compute module in DC-MHS form factor. KiCad source files, PDF exports, BOM. Month 14.

DC-SCM Interface Validation

Verified electrical and mechanical interface between compute module DC-SCM slot and OpenFSP module. Test report. Month 12.

Reference Platform Prototype

First physical prototype: compute module in DC-MHS chassis with OpenFSP on DC-SCM, managed by OpenHMC. Founding member evaluation units. Month 24.

Manufacturing BOM and DFM Guide

Design for manufacturing guide, qualified component alternatives, and manufacturing partner qualification criteria. Month 28.

Certification Package

OCP Accepted submission, UL/CE/FCC certification path documentation, government procurement qualification guidance. Month 36.

Transition Path for Existing IBM POWER Estates

The reference platform is not positioned as a disruptive replacement requiring immediate migration. Rather, the project will publish a staged transition architecture for organizations with existing IBM POWER deployments:

  • Phase A — Software first: Deploy OpenHMC alongside existing IBM HMC to manage OPAL-based OpenPOWER systems. Validate management workflows without changing IBM commercial hardware.
  • Phase B — Mixed estate: Introduce reference platform compute nodes into the estate. OpenHMC manages both IBM commercial POWER and reference platform nodes from a single console.
  • Phase C — Full transition: Reference platform nodes carry the workload. IBM POWER nodes retained for AIX/IBM i workloads (which require IBM's PowerVM and have no open equivalent in scope).

This path lets regulated industries begin the sovereignty transition immediately, without a flag-day cutover, and without abandoning existing IBM POWER investments.

Milestones

  • Month 1TSC formed with hardware engineers from Founding Members. OCP project liaison established.
  • Month 4Platform requirements specification v1.0 published. OCP DC-MHS and DC-SCM interface requirements finalized.
  • Month 8Compute module schematic draft. DC-SCM slot design complete. Power and thermal budget analysis.
  • Month 12DC-SCM interface validated with OpenFSP hardware. PCB layout of compute module begun.
  • Month 16Compute module PCB fabrication. Bring-up and basic boot on prototype hardware. OpenCore processor FPGA proxy integration.
  • Month 20Full platform bring-up: compute module + OpenFSP + OpenHMC integration tested on prototype hardware.
  • Month 24Evaluation prototype units delivered to Founding Members. Integration validation begins.
  • Month 28Manufacturing BOM published. Design-for-manufacturing review complete. OCP Accepted submission filed.
  • Month 36Production-ready reference platform. OpenCore ASIC integration complete. Certification documentation published.